R&D Engineer Firmware at Broadcom
Pay by year, the work locations, and the prevailing-wage level breakdown.
What does Broadcom pay a R&D Engineer Firmware on an H-1B?
$151k Broadcom has filed 53 H-1B labor condition applications for the role of R&D Engineer Firmware with the U.S. Department of Labor between FY2018 and FY2026 at a median base salary of $151k. Most of those filings fall between $125k and $171k. Base salary is the wage stated on the filing, not total compensation.
H-1B LCA filings
53
Median base salary
$151k
Middle 50%
$125k to $171k
Filings and pay by year
R&D Engineer Firmware at Broadcom, by fiscal year
Show the numbers behind this chart
| Fiscal year | Filings | Median base salary |
|---|---|---|
| FY2026 (partial) | 5 | $203k |
| FY2025 | 3 | $161k |
| FY2024 | 4 | $165k |
| FY2023 | 3 | $189k |
| FY2022 | 7 | $150k |
| FY2021 | 6 | $149k |
| FY2020 | 10 | $130k |
| FY2019 | 8 | $126k |
| FY2018 | 7 | $111k |
A fiscal year marked partial is still in progress, so its total is lower than a complete year and the two are not comparable.
Where this work is
Work locations named on the filings, most common first
| Location | Filings | Median base salary |
|---|---|---|
| San Jose, CA | 31 | $155k |
| San Diego, CA | 9 | $128k |
| Andover, MA | 5 | $118k |
| Austin, TX | 4 | $137k |
| Irvine, CA | 4 | $136k |
Prevailing-wage level
The experience level DOL assigns the role, I (entry) to IV (expert)
| Level | Filings | Median base salary |
|---|---|---|
| Level II | 6 | $104k |
| Level III | 4 | $106k |
| Level IV | 18 | $155k |
Other roles Broadcom sponsors
R&D Engineer IC Design 428R&D Engineer Hardware 178R&D Engineer Software 163R&D Engineer SW Quality 56R&D Engineer Applications 38R&D Engineer Test 35R&d Engineer Ic Design 4 28R&d Engineer Ic Design 5 26Product Marketing Engineer 16R&d Engineer Ic Design 3 16R&d Engineer Hardware 4 13R&D Engineer Software Quality 12