Engineer II - Embedded at Dish
Pay by year, the work locations, and the prevailing-wage level breakdown.
What does Dish pay a Engineer II - Embedded on an H-1B?
$74k Dish has filed 38 H-1B labor condition applications for the role of Engineer II - Embedded with the U.S. Department of Labor between FY2017 and FY2023 at a median base salary of $74k. Most of those filings fall between $73k and $74k. Base salary is the wage stated on the filing, not total compensation.
H-1B LCA filings
38
Median base salary
$74k
Middle 50%
$73k to $74k
Filings and pay by year
Engineer II - Embedded at Dish, by fiscal year
Show the numbers behind this chart
| Fiscal year | Filings | Median base salary |
|---|---|---|
| FY2023 | 1 | $84k |
| FY2022 | 1 | $94k |
| FY2021 | 7 | $74k |
| FY2020 | 4 | $74k |
| FY2019 | 6 | $73k |
| FY2018 | 9 | $73k |
| FY2017 | 10 | $74k |
Where this work is
Work locations named on the filings, most common first
| Location | Filings | Median base salary |
|---|---|---|
| Englewood, CO | 38 | $74k |
Prevailing-wage level
The experience level DOL assigns the role, I (entry) to IV (expert)
| Level | Filings | Median base salary |
|---|---|---|
| Level I | 31 | $74k |
| Level II | 5 | $89k |
Other roles Dish sponsors
Senior Engineer-Software 183Staff Engineer - Software 183Engineer II-Software 82Senior Engineer - Wireless 69Principal Engineer - Software 66Senior Software Test Engineer 60Engineer II - Wireless 56Senior Analyst/Developer 51Software Test Engineer II 41Senior RF Engineer 40RF Engineer II 39Data Scientist II 36