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H1BSalary.net

Packaging Engineer at Intel

Pay by year, the work locations, and the prevailing-wage level breakdown.

What does Intel pay a Packaging Engineer on an H-1B?

$106k Intel has filed 771 H-1B labor condition applications for the role of Packaging Engineer with the U.S. Department of Labor between FY2017 and FY2026 at a median base salary of $106k. Most of those filings fall between $95k and $117k. Base salary is the wage stated on the filing, not total compensation.

H-1B LCA filings
771
Median base salary
$106k
Middle 50%
$95k to $117k

Filings and pay by year

Packaging Engineer at Intel, by fiscal year

Show the numbers behind this chart
Intel Packaging Engineer H-1B filings and median base salary by fiscal year
Fiscal yearFilingsMedian base salary
FY2026 (partial)46$136k
FY202570$123k
FY2024118$103k
FY2023177$106k
FY2022159$117k
FY202192$106k
FY202044$88k
FY201926$89k
FY201820$91k
FY201719$89k

A fiscal year marked partial is still in progress, so its total is lower than a complete year and the two are not comparable.

Where this work is

Work locations named on the filings, most common first

LocationFilingsMedian base salary
Chandler, AZ481$110k
Hillsboro, OR181$96k
Aloha, OR77$95k
Santa Clara, CA17$123k
San Jose, CA5$123k
Folsom, CA3$105k
San Diego, CA2$93k
Arlington, TX1$127k
Dallas, TX1$89k
Fremont, CA1$102k
Oregon, OR1$96k
Plano, TX1$104k

Prevailing-wage level

The experience level DOL assigns the role, I (entry) to IV (expert)

LevelFilingsMedian base salary
Level II183$90k
Level III546$110k
Level IV10$128k

Other roles Intel sponsors

See Intel's full H-1B and green-card profile