Packaging Engineer at Texas Instruments
Pay by year, the work locations, and the prevailing-wage level breakdown.
What does Texas Instruments pay a Packaging Engineer on an H-1B?
$121k Texas Instruments has filed 29 H-1B labor condition applications for the role of Packaging Engineer with the U.S. Department of Labor between FY2017 and FY2025 at a median base salary of $121k. Most of those filings fall between $107k and $128k. Base salary is the wage stated on the filing, not total compensation.
H-1B LCA filings
29
Median base salary
$121k
Middle 50%
$107k to $128k
Filings and pay by year
Packaging Engineer at Texas Instruments, by fiscal year
Show the numbers behind this chart
| Fiscal year | Filings | Median base salary |
|---|---|---|
| FY2025 | 1 | $125k |
| FY2023 | 3 | $127k |
| FY2021 | 2 | $130k |
| FY2020 | 5 | $113k |
| FY2019 | 5 | $128k |
| FY2018 | 9 | $109k |
| FY2017 | 4 | $123k |
Where this work is
Work locations named on the filings, most common first
| Location | Filings | Median base salary |
|---|---|---|
| Dallas, TX | 16 | $114k |
| Santa Clara, CA | 9 | $128k |
| Warrenville, IL | 4 | $105k |
Prevailing-wage level
The experience level DOL assigns the role, I (entry) to IV (expert)
| Level | Filings | Median base salary |
|---|---|---|
| Level III | 19 | $116k |
| Level IV | 8 | $128k |