Android Build and Release Engineer, H-1B salary
What 7 H-1B filings report for “Android Build and Release Engineer” (LCA, FY2017–2026): pay percentiles, the states paying most, and who files.
What is the H-1B salary for an Android Build and Release Engineer?
$105k median H-1B base salary for an Android Build and Release Engineer, typically $92k to $136k, across 7 H-1B LCA filings with the U.S. Department of Labor (FY2018 to FY2026).
No exact matches for “Android Build and Release Engineer”, showing the closest job titles.
Median pay & filings over time · H-1B · FY2017–2026*
Top-paying states
Median for this title · ≥20 filings
Not enough state-level data.
Which companies sponsor H-1B for an Android Build and Release Engineer?
The employers that file the most H-1B labor condition applications for Android Build and Release Engineer roles are Microinfo and 3MD, based on their U.S. Department of Labor (LCA) filings. Open any for its full Android Build and Release Engineer filing history, pay, and open roles.
Top employers for this title
Most H-1B filings · with each employer’s median for the role
- 1Microinfo3 filings$96k
- 23MD2 filings$114k
- 3Lucid Motors1 filings$156k
- 4Veridic Solutions1 filings$85k
Figures are for the exact title “Android Build and Release Engineer”; for a rare title we widen to the closest related titles (flagged above when that happens). To benchmark a specific offer by employer and state, use Salary Check.