Application Specific Integrated Circuit Design Engineer, H-1B salary
What 201 H-1B filings report for “Application Specific Integrated Circuit Design Engineer” (LCA, FY2017–2026): pay percentiles, the states paying most, and who files.
What is the H-1B salary for an Application Specific Integrated Circuit Design Engineer?
$135k median H-1B base salary for an Application Specific Integrated Circuit Design Engineer, typically $105k to $174k, across 201 H-1B LCA filings with the U.S. Department of Labor (FY2019 to FY2021). Highest in California at $140k median.
Median pay & filings over time · H-1B · FY2017–2026*
Top-paying states
Median for this title · ≥20 filings
- 1California145$140k+$5k
- 2Texas47$115k−$20k
Where the pay sits state by state, against the national $135kfor the same title. States with at least 20 filings, so a median is not built on a handful of rows.
Top employers for this title
Most H-1B filings · with each employer’s median for the role
- 1Apple201 filings$135k
Figures are for the exact title “Application Specific Integrated Circuit Design Engineer”; for a rare title we widen to the closest related titles (flagged above when that happens). To benchmark a specific offer by employer and state, use Salary Check.