Component Design Engineer, H-1B salary
Median base salary across 6,085 H-1B filings for “Component Design Engineer” (LCA, FY2017–2026).
What is the H-1B salary for a Component Design Engineer?
$111k median certified base salary for a Component Design Engineer, typically $86k to $150k, across 6,085 approved H-1B LCA filings with the U.S. Department of Labor (FY2017 to FY2025). Highest in Washington at $125k median.
Median pay & filings over time
H-1B · FY2017–2026*
Top-paying states
Median for this title · ≥20 filings
Which companies sponsor H-1B for a Component Design Engineer?
The employers that file the most H-1B petitions for Component Design Engineer roles are Intel, Altera Corporation, Micron, Esencia Technologies Inc., and Plastic Omnium, based on their U.S. Department of Labor (LCA) filings. Open any for its full Component Design Engineer filing history, pay, and open roles.
Top employers for this title
Most H-1B filings · with each employer’s median for the role
- 1Intel6,070 filings$115k
- 2Altera Corporation9 filings$132k
- 3Micron2 filings$156k
- 4Esencia Technologies Inc.1 filings$115k
- 5Plastic Omnium1 filings$120k
- 6SK Hynix NAND Product Solutions Corp1 filings$152k
- 7Ssit Group, Inc1 filings$102k
Figures are for the exact title “Component Design Engineer”; for a rare title we widen to the closest related titles (flagged above when that happens). To benchmark a specific offer by employer and state, use Salary Check.