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EE Component Design and Release Engineer, H-1B salary

What 4 H-1B filings report for “EE Component Design and Release Engineer” (LCA, FY20172026): pay percentiles, the states paying most, and who files.

What is the H-1B salary for an EE Component Design and Release Engineer?

$74k median H-1B base salary for an EE Component Design and Release Engineer, typically $64k to $81k, across 4 H-1B LCA filings with the U.S. Department of Labor (FY2018 to FY2021).

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Entry-ish (p10)
$64k
10th percentile
Middle 50% (p25–p75)
$68k–$79k
interquartile range
Median base salary
$73,840
4 filings
Top (p90)
$81k
90th percentile
p10 $64k
median $74k
p90 $81k

Median pay & filings over time · H-1B · FY2017–2026*

Top-paying states

Median for this title · ≥20 filings

Not enough state-level data.

Which companies sponsor H-1B for an EE Component Design and Release Engineer?

The employer that files the most H-1B labor condition applications for EE Component Design and Release Engineer roles is Advantage Technical Resourcing, based on its U.S. Department of Labor (LCA) filings. Open any for its full EE Component Design and Release Engineer filing history, pay, and open roles.

Top employers for this title

Most H-1B filings · with each employer’s median for the role

Figures are for the exact title “EE Component Design and Release Engineer”; for a rare title we widen to the closest related titles (flagged above when that happens). To benchmark a specific offer by employer and state, use Salary Check.