Embedded Firmware Engineer III, H-1B salary
What 7 H-1B filings report for “Embedded Firmware Engineer III” (LCA, FY2017–2026): pay percentiles, the states paying most, and who files.
What is the H-1B salary for an Embedded Firmware Engineer III?
$130k median H-1B base salary for an Embedded Firmware Engineer III, typically $105k to $147k, across 7 H-1B LCA filings with the U.S. Department of Labor (FY2017 to FY2026).
No exact matches for “Embedded Firmware Engineer III”, showing the closest job titles.
Median pay & filings over time · H-1B · FY2017–2026*
Top-paying states
Median for this title · ≥20 filings
Not enough state-level data.
Which companies sponsor H-1B for an Embedded Firmware Engineer III?
The employer that files the most H-1B labor condition applications for Embedded Firmware Engineer III roles is Reddington Consulting, based on its U.S. Department of Labor (LCA) filings. Open any for its full Embedded Firmware Engineer III filing history, pay, and open roles.
Top employers for this title
Most H-1B filings · with each employer’s median for the role
- 1Reddington Consulting2 filings$123k
- 2Aurora Innovation1 filings$145k
- 3Bose1 filings$96k
- 4Universal Electronics1 filings$123k
- 5Varian Medical Systems1 filings$130k
- 6Zero Motorcycles1 filings$150k
Figures are for the exact title “Embedded Firmware Engineer III”; for a rare title we widen to the closest related titles (flagged above when that happens). To benchmark a specific offer by employer and state, use Salary Check.