Lead Design Release Engineer, H-1B salary
What 8 H-1B filings report for “Lead Design Release Engineer” (LCA, FY2017–2026): pay percentiles, the states paying most, and who files.
What is the H-1B salary for a Lead Design Release Engineer?
$109k median H-1B base salary for a Lead Design Release Engineer, typically $95k to $115k, across 8 H-1B LCA filings with the U.S. Department of Labor (FY2017 to FY2023).
Median pay & filings over time · H-1B · FY2017–2026*
Top-paying states
Median for this title · ≥20 filings
Not enough state-level data.
Which companies sponsor H-1B for a Lead Design Release Engineer?
The employers that file the most H-1B labor condition applications for Lead Design Release Engineer roles are General Motors and Sumitomo Electric Wiring Systems, based on their U.S. Department of Labor (LCA) filings. Open any for its full Lead Design Release Engineer filing history, pay, and open roles.
Top employers for this title
Most H-1B filings · with each employer’s median for the role
- 1General Motors3 filings$110k
- 2Sumitomo Electric Wiring Systems2 filings$108k
- 3Dana1 filings$113k
- 4Karma Automotive1 filings$108k
- 5Omnex Systems, LLC1 filings$85k
Related titles in this family
15 filings carry “Lead Design Release Engineer” in the title, across 5 variants. Pay differs by variant, so each is listed with its own median.
- 1Lead Design Release Engineer - Audio Systems2 filings$91k
- 2Lead Design Release Engineer – Performance Data Recorder2 filings$107k
- 3Lead Design Release Engineer, Structures2 filings$130k
- 4Integrated Center Stack Lead Design Release Engineer1 filings$90k
Figures are for the exact title “Lead Design Release Engineer”; for a rare title we widen to the closest related titles (flagged above when that happens). To benchmark a specific offer by employer and state, use Salary Check.