Lead Embedded Firmware Engineer, H-1B salary
What 7 H-1B filings report for “Lead Embedded Firmware Engineer” (LCA, FY2017–2026): pay percentiles, the states paying most, and who files.
What is the H-1B salary for a Lead Embedded Firmware Engineer?
$131k median H-1B base salary for a Lead Embedded Firmware Engineer, typically $103k to $139k, across 7 H-1B LCA filings with the U.S. Department of Labor (FY2017 to FY2026).
No exact matches for “Lead Embedded Firmware Engineer”, showing the closest job titles.
Median pay & filings over time · H-1B · FY2017–2026*
Top-paying states
Median for this title · ≥20 filings
Not enough state-level data.
Which companies sponsor H-1B for a Lead Embedded Firmware Engineer?
The employers that file the most H-1B labor condition applications for Lead Embedded Firmware Engineer roles are Cooper Lighting and Eaton, based on their U.S. Department of Labor (LCA) filings. Open any for its full Lead Embedded Firmware Engineer filing history, pay, and open roles.
Top employers for this title
Most H-1B filings · with each employer’s median for the role
- 1Cooper Lighting2 filings$102k
- 2Eaton2 filings$139k
- 3Martians, Inc.1 filings$131k
- 4OmniOn Power1 filings$124k
- 5Proxy Technologies Inc.1 filings$140k
Related titles in this family
5 filings carry “Lead Embedded Firmware Engineer” in the title, across 2 variants. Pay differs by variant, so each is listed with its own median.
- 1Lead Embedded Firmware Engineer - Power Electronics1 filings$124k
Figures are for the exact title “Lead Embedded Firmware Engineer”; for a rare title we widen to the closest related titles (flagged above when that happens). To benchmark a specific offer by employer and state, use Salary Check.