Principal Embedded Firmware Engineer, H-1B salary
What 5 H-1B filings report for “Principal Embedded Firmware Engineer” (LCA, FY2017–2026): pay percentiles, the states paying most, and who files.
What is the H-1B salary for a Principal Embedded Firmware Engineer?
$160k median H-1B base salary for a Principal Embedded Firmware Engineer, typically $138k to $261k, across 5 H-1B LCA filings with the U.S. Department of Labor (FY2018 to FY2026).
Median pay & filings over time · H-1B · FY2017–2026*
Top-paying states
Median for this title · ≥20 filings
Not enough state-level data.
Which companies sponsor H-1B for a Principal Embedded Firmware Engineer?
The employer that files the most H-1B labor condition applications for Principal Embedded Firmware Engineer roles is Seyond, based on its U.S. Department of Labor (LCA) filings. Open any for its full Principal Embedded Firmware Engineer filing history, pay, and open roles.
Top employers for this title
Most H-1B filings · with each employer’s median for the role
- 1Seyond2 filings$260k
- 2Locix1 filings$160k
- 3Medtronic1 filings$126k
- 4Solpad, Inc. F/K/A/ Sunculture Solar, Inc.1 filings$156k
Figures are for the exact title “Principal Embedded Firmware Engineer”; for a rare title we widen to the closest related titles (flagged above when that happens). To benchmark a specific offer by employer and state, use Salary Check.