Principal Ic Packaging Engineer, H-1B salary
What 2 H-1B filings report for “Principal Ic Packaging Engineer” (LCA, FY2017–2026): pay percentiles, the states paying most, and who files.
What is the H-1B salary for a Principal Ic Packaging Engineer?
$158k median H-1B base salary for a Principal Ic Packaging Engineer, typically $152k to $164k, across 2 H-1B LCA filings with the U.S. Department of Labor (FY2022 to FY2025).
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Entry-ish (p10)
$152k
10th percentile
Middle 50% (p25–p75)
$154k–$162k
interquartile range
Median base salary
$157,680
2 filings
Top (p90)
$164k
90th percentile
p10 $152k
median $158k
p90 $164k
Median pay & filings over time · H-1B · FY2017–2026*
Top-paying states
Median for this title · ≥20 filings
Not enough state-level data.
Top employers for this title
Most H-1B filings · with each employer’s median for the role
- 1NXP Semiconductors2 filings$158k
Figures are for the exact title “Principal Ic Packaging Engineer”; for a rare title we widen to the closest related titles (flagged above when that happens). To benchmark a specific offer by employer and state, use Salary Check.