R D Engineer Firmware, H-1B salary
What 108 H-1B filings report for “R D Engineer Firmware” (LCA, FY2017–2026): pay percentiles, the states paying most, and who files.
What is the H-1B salary for a R D Engineer Firmware?
$136k median H-1B base salary for a R D Engineer Firmware, typically $102k to $176k, across 108 H-1B LCA filings with the U.S. Department of Labor (FY2018 to FY2026). Highest in California at $155k median.
Median pay & filings over time · H-1B · FY2017–2026*
Top-paying states
Median for this title · ≥20 filings
- 1California60$155k+$19k
- 2Georgia24$121k−$15k
Where the pay sits state by state, against the national $136kfor the same title. States with at least 20 filings, so a median is not built on a handful of rows.
Which companies sponsor H-1B for a R D Engineer Firmware?
The employers that file the most H-1B labor condition applications for R D Engineer Firmware roles are LSI Corporation and Broadcom, based on their U.S. Department of Labor (LCA) filings. Open any for its full R D Engineer Firmware filing history, pay, and open roles.
Top employers for this title
Most H-1B filings · with each employer’s median for the role
- 1LSI Corporation54 filings$128k
- 2Broadcom53 filings$151k
- 3Emulex1 filings$153k
Related titles in this family
134 filings carry “R D Engineer Firmware” in the title, across 5 variants. Pay differs by variant, so each is listed with its own median.
- 1R&d Engineer Firmware 311 filings$106k
- 2R&d Engineer Firmware 26 filings$89k
- 3R&d Engineer Firmware 56 filings$113k
- 4R&d Engineer Firmware 43 filings$122k
Figures are for the exact title “R D Engineer Firmware”; for a rare title we widen to the closest related titles (flagged above when that happens). To benchmark a specific offer by employer and state, use Salary Check.