Wireless ASIC Design Engineer, H-1B salary
What 21 H-1B filings report for “Wireless ASIC Design Engineer” (LCA, FY2017–2026): pay percentiles, the states paying most, and who files.
What is the H-1B salary for a Wireless ASIC Design Engineer?
$150k median H-1B base salary for a Wireless ASIC Design Engineer, typically $120k to $210k, across 21 H-1B LCA filings with the U.S. Department of Labor (FY2019 to FY2021).
Median pay & filings over time · H-1B · FY2017–2026*
Top-paying states
Median for this title · ≥20 filings
- 1California20$148k−$2k
Where the pay sits state by state, against the national $150kfor the same title. States with at least 20 filings, so a median is not built on a handful of rows.
Top employers for this title
Most H-1B filings · with each employer’s median for the role
- 1Apple21 filings$150k
Figures are for the exact title “Wireless ASIC Design Engineer”; for a rare title we widen to the closest related titles (flagged above when that happens). To benchmark a specific offer by employer and state, use Salary Check.