Director Firmware Engineering, H-1B salary
What 15 H-1B filings report for “Director Firmware Engineering” (LCA, FY2017–2026): pay percentiles, the states paying most, and who files.
What is the H-1B salary for a Director Firmware Engineering?
$216k median H-1B base salary for a Director Firmware Engineering, typically $177k to $275k, across 15 H-1B LCA filings with the U.S. Department of Labor (FY2019 to FY2026).
Median pay & filings over time · H-1B · FY2017–2026*
Top-paying states
Median for this title · ≥20 filings
Not enough state-level data.
Which companies sponsor H-1B for a Director Firmware Engineering?
The employers that file the most H-1B labor condition applications for Director Firmware Engineering roles are Western Digital, Rivian, SK hynix memory solutions America, and SanDisk, based on their U.S. Department of Labor (LCA) filings. Open any for its full Director Firmware Engineering filing history, pay, and open roles.
Top employers for this title
Most H-1B filings · with each employer’s median for the role
- 1Western Digital5 filings$223k
- 2Rivian2 filings$305k
- 3SK hynix memory solutions America2 filings$223k
- 4SanDisk2 filings$216k
- 5Knowles1 filings$195k
- 6Otsuka Precision Health1 filings$170k
- 7Otsuka1 filings$170k
- 8View1 filings$211k
Related titles in this family
18 filings carry “Director Firmware Engineering” in the title, across 3 variants. Pay differs by variant, so each is listed with its own median.
- 1Sr. Director, Firmware Engineering2 filings$305k
- 2Technical Director Firmware Engineering1 filings$184k
Figures are for the exact title “Director Firmware Engineering”; for a rare title we widen to the closest related titles (flagged above when that happens). To benchmark a specific offer by employer and state, use Salary Check.