Embedded Engineer II, H-1B salary
What 8 H-1B filings report for “Embedded Engineer II” (LCA, FY2017–2026): pay percentiles, the states paying most, and who files.
What is the H-1B salary for an Embedded Engineer II?
$121k median H-1B base salary for an Embedded Engineer II, typically $92k to $132k, across 8 H-1B LCA filings with the U.S. Department of Labor (FY2022 to FY2025).
Median pay & filings over time · H-1B · FY2017–2026*
Top-paying states
Median for this title · ≥20 filings
Not enough state-level data.
Which companies sponsor H-1B for an Embedded Engineer II?
The employers that file the most H-1B labor condition applications for Embedded Engineer II roles are WHOOP and Bose, based on their U.S. Department of Labor (LCA) filings. Open any for its full Embedded Engineer II filing history, pay, and open roles.
Top employers for this title
Most H-1B filings · with each employer’s median for the role
- 1WHOOP4 filings$130k
- 2Bose3 filings$100k
- 3Automotive Robotics1 filings$75k
Related titles in this family
18 filings carry “Embedded Engineer II” in the title, across 6 variants. Pay differs by variant, so each is listed with its own median.
- 1Senior Embedded Engineer II4 filings$130k
- 2Embedded Engineer III3 filings$110k
- 3Embedded Engineer II, Camera Systems1 filings$150k
- 4Software Embedded Engineer II1 filings$120k
- 5Wireless Embedded Engineer II1 filings$145k
Figures are for the exact title “Embedded Engineer II”; for a rare title we widen to the closest related titles (flagged above when that happens). To benchmark a specific offer by employer and state, use Salary Check.