Ic Packaging Engineer, H-1B salary
What 18 H-1B filings report for “Ic Packaging Engineer” (LCA, FY2017–2026): pay percentiles, the states paying most, and who files.
What is the H-1B salary for an Ic Packaging Engineer?
$174k median H-1B base salary for an Ic Packaging Engineer, typically $149k to $183k, across 18 H-1B LCA filings with the U.S. Department of Labor (FY2020 to FY2025).
Median pay & filings over time · H-1B · FY2017–2026*
Top-paying states
Median for this title · ≥20 filings
Not enough state-level data.
Top employers for this title
Most H-1B filings · with each employer’s median for the role
- 1Apple18 filings$174k
Related titles in this family
56 filings carry “Ic Packaging Engineer” in the title, across 6 variants. Pay differs by variant, so each is listed with its own median.
- 1Ic Packaging Engineering29 filings$155k
- 2Senior Ic Packaging Engineer4 filings$111k
- 3Principal Ic Packaging Engineer2 filings$158k
- 4Staff Ic Packaging Engineer2 filings$130k
- 5Ic Packaging Engineer, Characterization and Simulation1 filings$155k
Figures are for the exact title “Ic Packaging Engineer”; for a rare title we widen to the closest related titles (flagged above when that happens). To benchmark a specific offer by employer and state, use Salary Check.