Manager Firmware Engineering, H-1B salary
What 20 H-1B filings report for “Manager Firmware Engineering” (LCA, FY2017–2026): pay percentiles, the states paying most, and who files.
What is the H-1B salary for a Manager Firmware Engineering?
$173k median H-1B base salary for a Manager Firmware Engineering, typically $125k to $194k, across 20 H-1B LCA filings with the U.S. Department of Labor (FY2017 to FY2026).
Median pay & filings over time · H-1B · FY2017–2026*
Top-paying states
Median for this title · ≥20 filings
Not enough state-level data.
Which companies sponsor H-1B for a Manager Firmware Engineering?
The employers that file the most H-1B labor condition applications for Manager Firmware Engineering roles are Milwaukee Electric Tool, Micron, Western Digital, and AMD, based on their U.S. Department of Labor (LCA) filings. Open any for its full Manager Firmware Engineering filing history, pay, and open roles.
Top employers for this title
Most H-1B filings · with each employer’s median for the role
- 1Milwaukee Electric Tool5 filings$125k
- 2Micron4 filings$181k
- 3Western Digital4 filings$157k
- 4AMD3 filings$185k
- 5GoPro1 filings$211k
- 6Samsara1 filings$219k
- 7Tesla1 filings$183k
- 8View1 filings$185k
Related titles in this family
44 filings carry “Manager Firmware Engineering” in the title, across 3 variants. Pay differs by variant, so each is listed with its own median.
- 1Senior Manager, Firmware Engineering19 filings$190k
- 2Sr. Manager Firmware Engineering5 filings$190k
Figures are for the exact title “Manager Firmware Engineering”; for a rare title we widen to the closest related titles (flagged above when that happens). To benchmark a specific offer by employer and state, use Salary Check.