Principal Engineer Firmware Engineering, H-1B salary
What 101 H-1B filings report for “Principal Engineer Firmware Engineering” (LCA, FY2017–2026): pay percentiles, the states paying most, and who files.
What is the H-1B salary for a Principal Engineer Firmware Engineering?
$141k median H-1B base salary for a Principal Engineer Firmware Engineering, typically $116k to $165k, across 101 H-1B LCA filings with the U.S. Department of Labor (FY2017 to FY2026).
Median pay & filings over time · H-1B · FY2017–2026*
Top-paying states
Median for this title · ≥20 filings
- 1California84$144k+$3k
Where the pay sits state by state, against the national $141kfor the same title. States with at least 20 filings, so a median is not built on a handful of rows.
Which companies sponsor H-1B for a Principal Engineer Firmware Engineering?
The employer that files the most H-1B labor condition applications for Principal Engineer Firmware Engineering roles is Western Digital, based on its U.S. Department of Labor (LCA) filings. Open any for its full Principal Engineer Firmware Engineering filing history, pay, and open roles.
Top employers for this title
Most H-1B filings · with each employer’s median for the role
- 1Western Digital93 filings$140k
- 2SanDisk4 filings$170k
- 3GoPro4 filings$187k
Figures are for the exact title “Principal Engineer Firmware Engineering”; for a rare title we widen to the closest related titles (flagged above when that happens). To benchmark a specific offer by employer and state, use Salary Check.