Principal Engineer Packaging Engineering, H-1B salary
What 20 H-1B filings report for “Principal Engineer Packaging Engineering” (LCA, FY2017–2026): pay percentiles, the states paying most, and who files.
What is the H-1B salary for a Principal Engineer Packaging Engineering?
$164k median H-1B base salary for a Principal Engineer Packaging Engineering, typically $107k to $177k, across 20 H-1B LCA filings with the U.S. Department of Labor (FY2017 to FY2026).
Median pay & filings over time · H-1B · FY2017–2026*
Top-paying states
Median for this title · ≥20 filings
Not enough state-level data.
Which companies sponsor H-1B for a Principal Engineer Packaging Engineering?
The employers that file the most H-1B labor condition applications for Principal Engineer Packaging Engineering roles are SanDisk and Western Digital, based on their U.S. Department of Labor (LCA) filings. Open any for its full Principal Engineer Packaging Engineering filing history, pay, and open roles.
Top employers for this title
Most H-1B filings · with each employer’s median for the role
- 1SanDisk10 filings$170k
- 2Western Digital6 filings$152k
- 3GlobalFoundries4 filings$107k
Figures are for the exact title “Principal Engineer Packaging Engineering”; for a rare title we widen to the closest related titles (flagged above when that happens). To benchmark a specific offer by employer and state, use Salary Check.