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Firmware Engineer II, H-1B salary

What 77 H-1B filings report for “Firmware Engineer II” (LCA, FY2017–2026): pay percentiles, the states paying most, and who files.

What is the H-1B salary for a Firmware Engineer II?

$100k median H-1B base salary for a Firmware Engineer II, typically $79k to $128k, across 77 H-1B LCA filings with the U.S. Department of Labor (FY2017 to FY2026).

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Entry-ish (p10)
$79k
10th percentile
Middle 50% (p25–p75)
$90k–$117k
interquartile range
Median base salary
$100,172
77 filings
Top (p90)
$128k
90th percentile
p10 $79k
median $100k
p90 $128k

Median pay & filings over time · H-1B · FY2017–2026*

Top-paying states

Median for this title · ≥20 filings

Not enough state-level data.

Which companies sponsor H-1B for a Firmware Engineer II?

The employers that file the most H-1B labor condition applications for Firmware Engineer II roles are Toyota, Milwaukee Electric Tool, Starkey Laboratories, and CCL Label, based on their U.S. Department of Labor (LCA) filings. Open any for its full Firmware Engineer II filing history, pay, and open roles.

Top employers for this title

Most H-1B filings · with each employer’s median for the role

Related titles in this family

133 filings carry “Firmware Engineer II” in the title, across 15 variants. Pay differs by variant, so each is listed with its own median.

Figures are for the exact title “Firmware Engineer II”; for a rare title we widen to the closest related titles (flagged above when that happens). To benchmark a specific offer by employer and state, use Salary Check.