Firmware Engineering, H-1B salary
What 49 H-1B filings report for “Firmware Engineering” (LCA, FY2017–2026): pay percentiles, the states paying most, and who files.
What is the H-1B salary for a Firmware Engineering?
$193k median H-1B base salary for a Firmware Engineering, typically $149k to $227k, across 49 H-1B LCA filings with the U.S. Department of Labor (FY2025 to FY2026). Highest in California at $204k median.
Median pay & filings over time · H-1B · FY2017–2026*
Top-paying states
Median for this title · ≥20 filings
- 1California23$204k+$11k
- 2Washington21$172k−$21k
Where the pay sits state by state, against the national $193kfor the same title. States with at least 20 filings, so a median is not built on a handful of rows.
Top employers for this title
Most H-1B filings · with each employer’s median for the role
- 1Microsoft49 filings$193k
Related titles in this family
560 filings carry “Firmware Engineering” in the title, across 53 variants. Pay differs by variant, so each is listed with its own median.
- 1Principal Engineer, Firmware Engineering101 filings$141k
- 2Staff Engineer, Firmware Engineering68 filings$115k
- 3Technologist, Firmware Engineering67 filings$170k
- 4Senior Engineer, Firmware Engineering51 filings$93k
- 5Manager, Firmware Engineering20 filings$173k
- 6Senior Manager, Firmware Engineering19 filings$190k
- 7Firmware Engineering Manager18 filings$181k
- 8Software / Firmware Engineering Senior Engineer17 filings$132k
- 9Software / Firmware Engineering Principal Engineer16 filings$188k
- 10Director, Firmware Engineering15 filings$216k
- 11Software / Firmware Engineering Staff Engineer12 filings$130k
- 12Staff Engineer, Software / Firmware Engineering10 filings$142k
Figures are for the exact title “Firmware Engineering”; for a rare title we widen to the closest related titles (flagged above when that happens). To benchmark a specific offer by employer and state, use Salary Check.